# UKRI-3154 Indium deposition system

> Contract award record from UK public-sector procurement sources.

## Key facts

- Public buyer: [UK Research & Innovation](/buyers/uk-research-innovation/contract-awards)
- Contract winner: HHV Ltd
- Award value: £185,067
- Tender value: £185,067
- Award date: 20 December 2023
- Published: 5 January 2024
- Contract start: 2 January 2024
- Contract end: 1 January 2025
- Stage: awarded
- Procurement category: goods
- Notice ID: 6ca65c48-42ad-444c-a3eb-477fe75ce1a4-711682
- OCID: ocds-b5fd17-b1e87280-efde-4f0b-b83b-fb9e322092f5

## Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations\. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die\.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step\.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place\. Photo lithography \(negative resist, lift-off\) and shadow masking techniques are both used\. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day\.

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## Source

[View the original notice on Contracts Finder](https://www.contractsfinder.service.gov.uk/Notice/6ca65c48-42ad-444c-a3eb-477fe75ce1a4-711682)