# UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

> Tender notice from UK public-sector procurement sources.

## Key facts

- Public buyer: [BIP SOLUTIONS LIMITED](/buyers/bip-solutions-limited/contract-awards)
- Tender value: £1
- Published: 21 February 2024
- Planned start: 9 February 2024
- Planned end: 8 February 2025
- Stage: open_tender
- Procurement category: goods
- Notice ID: 7ae3de7f-fb7f-46f9-a438-61fa3bab3a65-723821
- OCID: ocds-b5fd17-1b166821-9c1f-4ff6-9d40-37e9de92f6c4

## Description

UK Research and Innovation's \(UKRI\) Science and Technology Facilities Council \(STFC\) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components\.

## Related contract awards

- [GB-Sheffield: Project Trellis](/contracts/ocds-b5fd17-5c952244-ca97-4d15-9c58-ec9f394c54a4): BIP SOLUTIONS LIMITED
- [GB-Sheffield: Project Sand](/contracts/ocds-b5fd17-1ee73634-8f45-420f-9918-baec0d80012a): BIP SOLUTIONS LIMITED
- [2026-10 Building Works, Supplies & Services including specialists and consultancy](/contracts/ocds-b5fd17-2be7317d-b9c5-492b-8524-6b1659920178): BIP SOLUTIONS LIMITED

## Source

[View the original notice on Contracts Finder](https://www.contractsfinder.service.gov.uk/Notice/7ae3de7f-fb7f-46f9-a438-61fa3bab3a65-723821)